| 熔点 | 3360°C |
| 溶解性 | Insoluble in water. |
| 应用 | antalum nitride is used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications. |
| 产品介绍 | 钽的氮化物，以1:1结构为主 |
| 别名 | 一氮化钽;Tantalum mononitride |
氮化钽
Tantalum nitride （订货以英文为准）
编号：T119195
CAS号：12033-62-4
分子式：TAN
分子量：194.95
| 产品名称 | Tantalum nitride |
| 中文名称 | 氮化钽 |
| CAS号 | 12033-62-4 |
| MDL编码 | MFCD00049568 |
| 分子式（M.F.） | TAN |
| 分子量（M.W.） | 194.95 |
| 标识符号 | https://www.aladdin-e.com/images/ghs/ghs07.jpg |
| 信号词 | Warning |
| 危害声明 | H315,H319,H335 |
| 警示性声明 | P261,P305+P351+P338 |
| 个人防护设备 | dust mask type N95 (US), Eyeshields, Gloves |
| WGK德国 | 2 |
| 风险声明 (欧洲) | R36/37/38 |
| 安全声明（欧洲） | S26 |
| 危害码（欧洲） | Xi |
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